Chosen Solution
Hi there! What’s the best temperature in celsius degrees to remove the Wi-Fi IC and, after that, solder the new one? Thank you!
There isn’t a set recipe for doing micro-BGA work with a hot air station. Everyone develops their own style and methods based on the station they have and whether or not the temperature is actually calibrated or not. Generally speaking, I use 380C on my hot air station (Hakko FR810) and I adapt the time spent heating a component to the type of IC I am working on, the proximity to sensitive or critical IC’s, the possibility of underfill and component density surrounding the IC in question. I would certainly start wth a lower temperature setting to pick at the underfill and then work on removing the IC at a higher temperature.
